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1st Fab

6833 Kinoko-cho, Ibara-shi, Okayama, Japan
Tel : +81-866-62-4400
Fax : +81-866-62-1930

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Wafer size 5inch Production capacity 35,000 wfs/month
Main foundry products Process rule Main related equipment Others
Bipolar transistor ≥5㎛ Stepper :g-line, i-line Test slope available
Dicing possible
RF transistor -
Bipolar IC ≥1.5㎛
MOSFET ≥1.0㎛
Wafer size 6 inch Production capacity 19,000wfs/month
Main foundry products Process rule Main related equipment Others
TVS diode ≥0.6㎛ Stepper : g line, i line Test slope available
Dizing possible
MOSFET -
IGBT ≥0.6㎛ Trench etcher IGBT : Backend treatment possible
CMOS 0.6㎛
PDK available
Test・probe available
CMOS Analog IC ≥0.6㎛ Laser trimming
MEMS sensor - DRIE/EVG bonding machine